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DeepX plans IPO after funding round as Hyundai and Baidu power its on device AI chips
Startups
Published on 24 April 2026
Hyundai and Baidu partnerships could shape the IPO path
Korean on-device AI chip startup DeepX is preparing for an initial public offering after completing its current funding round in the first half of the year, CEO Lokwon Kim told Reuters. The company plans to appoint IPO banks once that financing wraps up, and its work with Hyundai Motor and Baidu highlights growing commercial traction for on-device AI hardware.
- DeepX eyes an IPO after finishing its ongoing funding round
- Bank selection for the share offering will follow in 2026’s first half
- The startup builds on-device AI chips with industry backers
- Hyundai Motor and Baidu partnerships signal early market momentum
Read the full story at The Economic Times
This summarization was done by Beige for a story published on 
The Economic Times