TSMC’s leadership says AI is set to overtake smartphones as the semiconductor industry’s biggest growth engine. Speaking at the 2026 Taiwan Technology Symposium, Kevin Zhang projected global chip output could hit $1.5 trillion by 2030, signaling a major shift in how demand is being shaped as AI workloads drive new chip priorities and investment cycles.
TSMC has upgraded its long-term outlook for the global semiconductor industry, now forecasting the market will exceed $1.5 trillion by 2030. The company credits accelerating demand from artificial intelligence and high-performance computing, and says it expects rapid growth in advanced chip production while expanding manufacturing capacity in the US, Japan, and Germany.
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TSMC has approved a capital budget of over $31 billion to expand chip production, aiming to meet accelerating demand tied to AI and high-performance computing. The plan also includes major investment in its US operations. In a bid to capitalize on the tech boom, the company says shareholders will benefit through a higher dividend payout.
Despite reports that Apple may involve Intel in some chip efforts, experts expect Taiwan Semiconductor Manufacturing Co to remain Apple’s primary manufacturing partner. The reason: TSMC’s advanced process technology, dependable production, and edge in packaging and yields are viewed as hard to replace—especially for Apple’s most important devices.
TSMC is partnering with Sony Semiconductor Solutions to set up a joint venture in Kumamoto, Japan, aimed at developing and producing advanced image sensors. The deal blends Sony’s expertise in sensor design with TSMC’s manufacturing strength, signaling a major push to boost next-generation sensor production for fast-growing imaging needs.
Sony Semiconductor Solutions and TSMC have signed a non binding MOU for a joint venture in Kumamoto to build next generation AI ready CMOS image sensors. Sony will hold majority control and run a new facility, pairing its sensor design strength with TSMC process and manufacturing expertise. The Japanese government is expected to back phased investments, alongside Sony’s Nagasaki expansion.
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Chipmaker MediaTek has appointed former TSMC executive Douglas Yu as a part-time adviser, aiming to accelerate its advanced packaging capabilities. The hire is also tied to MediaTek’s push deeper into the AI chip market, with Yu guiding R&D direction and investment strategy for next-generation technologies.
Taiwan’s stock market has overtaken Canada to become the world’s sixth largest, fueled by booming demand for AI-linked shares and a steep surge in TSMC. Taiwan-listed firms’ market cap jumped more than 35% to $4.47 trillion, slightly ahead of Canada’s 5% rise. TSMC’s strength is so large it represents nearly 45% of the benchmark index.
TSMC expects its 2-nanometer chip production to expand rapidly, projecting about 70% annual growth from 2026 through 2028. The company is also gearing up its next A13 process for volume production in 2029. Together, these moves target rising AI and high-performance computing demand, while TSMC continues broadening global manufacturing capacity for future chip designs.
TSMC plans to open its first advanced chip packaging plant in an existing Arizona facility, with an executive pointing to 2029. The move targets advanced packaging techniques that join multiple components into modern AI chips. TSMC said it is seeking permits to start construction but has not specified when output will begin, raising expectations for supply relief.
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