Chipmaker MediaTek has appointed former TSMC executive Douglas Yu as a part-time adviser, aiming to accelerate its advanced packaging capabilities. The hire is also tied to MediaTek’s push deeper into the AI chip market, with Yu guiding R&D direction and investment strategy for next-generation technologies.
TSMC plans to open its first advanced chip packaging plant in an existing Arizona facility, with an executive pointing to 2029. The move targets advanced packaging techniques that join multiple components into modern AI chips. TSMC said it is seeking permits to start construction but has not specified when output will begin, raising expectations for supply relief.
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