Syenta raises 26 million to fix AI chip bottlenecks with a new manufacturing method

Published on 24 April 2026

A new process could unlock faster chip connections

Australian AI hardware startup Syenta has raised $26 million to scale a new chip manufacturing approach designed to ease AI supply bottlenecks. The firm plans to open an Arizona office and aims for high-volume production by 2028. Former Intel CEO Pat Gelsinger has joined Syenta’s board, signaling strong industry backing for faster chip connectivity and improved availability.

Syenta secured $26 million for an AI chip manufacturing breakthrough
The method targets AI supply chain and production constraints
Pat Gelsinger joins the board as expansion accelerates
High-volume production is targeted for 2028 with a US office

#supply chain #semiconductors #ai chips #funding #pat g elsinger

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Syenta raises 26 million to fix AI chip bottlenecks with a new manufacturing method

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