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India’s first advanced 3D chip packaging unit set to take shape in Odisha Info Valley
Technology
Published on 24 April 2026
Foundation stone laid on Akshay Tritiya for a new semiconductor push
Union Electronics and IT Minister Ashwini Vaishnaw said the foundation stone for India’s first advanced 3D chip packaging unit was laid in Odisha’s Info Valley on Akshay Tritiya. The minister called it a major milestone for high-tech manufacturing in the state, crediting support from Prime Minister Narendra Modi and Odisha Chief Minister Mohan Charan Majhi.
- Foundation stone laid for India’s first advanced 3D chip packaging unit
- Project announced for Odisha’s Info Valley on Akshay Tritiya
- Union Minister Ashwini Vaishnaw highlights boost to high-tech manufacturing
- Vaishnaw thanks PM Narendra Modi and Odisha CM Mohan Charan Majhi
Read the full story at The Economic Times
This summarization was done by Beige for a story published on 
The Economic Times